Path Engineering

As a Wire Bond Technician (also known as Electronic Assembly Operator, Microelectronics Technician), you'll perform a variety of electronic assembly operations on assemblies or sub-assemblies. You'll determine and follow methods and sequences of operations in wire bonding, make setups and adjustments according to blueprint specifications, and perform assembly and installation steps for components in production assemblies. You'll also maintain accurate logs and paperwork, operate and troubleshoot production line machinery and computers, and continuously meet/exceed production schedules and deadlines according to quality standards.

• Competitive compensation package.
• Opportunities for professional growth and development.
• Dynamic and supportive work environment.

• High School Diploma or equivalent.
• Experience performing detailed work under a microscope.
• Problem-solving skills and ability to follow detailed written and verbal instructions.
• Preferred: Microelectronics Assembly skills, ability to recognize non-conformities, and experience with auto-bonding on Palomars, Hesse, and/or H&K.
• Must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government.